Photo: Denis Paiste, Materials Research Laboratory, MIT, Julie Diop, AIM Academy, MIT
Integrated Photonics Industry Supply Chain Checkup
Sponsored by MIT Microphotonics Center, AIM Photonics Institute and Photon Delta
The 2020 Integrated Photonics System Roadmap will be released in June.
-hear reports from each of the Technology and Application Working Groups
-ask questions and determine critical issues for the next 5 years and the next 20 years
-participate in the breakout groups that validate the TWG Attribute Tables and Timelines
Speakers include:
Lionel Kimerling, MIT (supply chain)
Roel Baets, Ghent University (SiPh)
Gloria Hoeffler, Infinera (InP&III-V)
Mike Wale, Eindhoven University (InP&III-V)
Sami Musa, Vision & Action (SiN)
Michael Lebby, Lightwave Logic (polymer)
Terry Smith, 3M (ret.) (interconnects)
Peter Maat, Astron (interconnects)
Twan Korthorst, Synopsis (EPDA)
Tom Brown, University of Rochester (packaging)
Dick Otte, Promex Industries (assembly)
David Mackey, mBryonics (aerospace)
Anu Agarwal, MIT (sensors)
Presentation Program
June 8: 0900-1320(EDT)/1500-1900(CEST)/2200-0200(JST)
Silicon Photonics; InP/III-V; SiN; Polymer Materials; Interconnects; Electronic-Photonic Design Automation; Packaging; Assembly; Test
| CEST | EST | PST | JST | Agenda/Chapter |
| 15:00 | 9:00 | 6:00 | 22:00 | Meeting open |
| 15:15 | 9:15 | 6:15 | 22:15 | Key-note supply-chain |
| 15:35 | 9:35 | 6:35 | 22:35 | Introduction to Platforms |
| 15:40 | 9:40 | 6:40 | 22:40 | SiPh |
| 16:00 | 10:00 | 7:00 | 23:00 | InP & III-V |
| 16:20 | 10:20 | 7:20 | 23:20 | SiN |
| 16:40 | 10:40 | 7:40 | 23:40 | Break |
| 17:00 | 11:00 | 8:00 | 0:00 | Polymer |
| 17:20 | 11:20 | 8:20 | 0:20 | Interconnects |
| 17:40 | 11:40 | 8:40 | 0:40 | EPDA |
| 18:00 | 12:00 | 9:00 | 1:00 | Break |
| 18:20 | 12:20 | 9:20 | 1:20 | Packaging |
| 18:40 | 12:40 | 9:40 | 1:40 | Assembly |
| 19:00 | 13:00 | 10:00 | 2:00 | Test |
| 19:20 | 13:20 | 10:20 | 2:20 | Break |
Breakouts: 13:40-14:40 (EDT)
June 9: 9000-1200(EDT)/1500-1800(CEST)/2200-0100(JST)
Datacom/Telecom; Internet of Things; Automotive; Aerospace; Bio/Medical; Sensors; RF Photonics
| CEST | EST | PST | JST | Agenda/Chapter |
| 15:00 | 9:00 | 6:00 | 22:00 | Meeting open |
| 15:15 | 9:15 | 6:15 | 22:15 | Applications & Top-down approach |
| 15:35 | 9:35 | 6:35 | 22:35 | Technology instructions |
| 15:40 | 9:40 | 6:40 | 22:40 | Data/Telecom |
| 16:00 | 10:00 | 7:00 | 23:00 | IoT |
| 16:20 | 10:20 | 7:20 | 23:20 | Automotive |
| 16:40 | 10:40 | 7:40 | 23:40 | Break |
| 17:00 | 11:00 | 8:00 | 0:00 | Aerospace |
| 17:20 | 11:20 | 8:20 | 0:20 | Biosensing & medical |
| 17:40 | 11:40 | 8:40 | 0:40 | Sensors |
| 18:10 | 12:10 | 9:10 | 1:10 | Break |
| 18:30 | 12:30 | 9:30 | 1:30 | RF Photonics & Wireless |
| 18:50 | 12:50 | 9:50 | 1:50 | Interconnects |
| 19:00 | 13:00 | 10:00 | 2:00 | |
| Break-out sessions: | ||||
| Interconnects, Sensors, Imaging, RF Photonics, TWGs, PEGs |
Keynote Webinar Series Beginning July 7 (monthly): 1100-1200(EDT)/1700-1800(CEST)/2400-0100(JST)