Teaching Packages

The below teaching packages are for those intending to teach this content to students or professionals. Materials can include module blueprints, slides with instructor notes, and questions with answers.

Integrated Photonics

Integrated Silicon Photonics
Integrated silicon photonics

Integrated Silicon Photonics provides an introduction to optical confinement and waveguide constraints for a planar CMOS-compatible platform, followed by a review of the performance criteria for key passive/active planar devices, materials science or device physics insights for their chip integration, and leading-edge device designs and performance achievements.

When you click on the below link to download the teaching package, you will be first asked to fill out a survey, and then a terms-of-use agreement, and then will be able to download the file.

Design of Photonic Integrated Devices and Circuits
Si Photonic Circuit

Design of Photonic Integrated Devices and Circuits provides learners with approaches for designing photonic integrated devices and circuits using available photonic design automation tools, and how the essential building blocks, such as various passive and active devices, are combined to form various photonic integrated circuits.

The teaching package will be posted soon.

Photonics Materials and Devices
Monolithic Magneto-optic Isolator

There are two modules within Photonic Materials and Devices:

PMD1 - Fundamentals
PMD2 - Materials and Passive Devices
 

They can be used individually, or in sequence.

Below is a complete description of the modules.

Here you can find the seven parts of the M1- Fundamentals module (files PMD1.1-PMD1.7),  as well as a folder that includes all seven sections (PMD1).

PMD1.1:
Information Evolution and Integrated Photonics
Multicore chip evolution
Metal line delay and photonics for data transfer
PIC technology timeline forecast

PMD1.2:
Light-Matter Interaction
Optics and the Wave Equation
Polarizability model for dielectric constant
Dispersion absorption

PMD1.3:
Bands and Bonds
Atomic bonding and optical, thermal, mechanical property trends
Bandstructure, band gap, and effective mass
Carrier scattering

PMD1.4:
Materials Design

Alloy design
Thin-film strain design
Structural and thermal properties
Case study: materials design for fiber-optic systems

PMD1.5:
Optical Links

WDM optical communications link
Dispersion/attenuation limited link design

PMD1.6:
System Design

Attenuation-limited versus dispersion-limited optical link
Advanced modulation formats

PMD1.7:
WDM Device Components

Principal device components for a WDM capacity optical link 

PMD1.1.zip3.33 MB
PMD1.zip14.88 MB