AIM Photonics is hiring

AIM Photonics Institute
Albany and Rochester

The AIM Photonics Test, Assembly, and Packaging (TAP) facility in Rochester, NY is dedicated to advanced photonic and electronic packaging.  

Full custom photonic chip-scale 300mm wafer-scale packaging including heterogeneous integration capability.

Best-in-class 300m silicon photonic integrated circuit technology in Albany, NY

Opportunities in all electronic and photonic design automation, heterogeneous integration , III-V gain and lasers integrated into silicon PICS, MPW support, PIC component design, and application engineering technical areas.

Learn more below.