Presenter: Dick Otte (Promex)
This webinar addresses the findings of the IPSR Assembly Technology Working Group (TWG), starting with assembly related design needs andincluding assembly processes (e.g., semiconductor wafer backgrinding, wafer singulation, die attach processes, etc.)
You can the find slides here.
Presenters: Anu Agarwal (MIT) and Ben Miller (U Rochester)
This talk will present a progress report on the development of a roadmap for Integrated Photonic Sensors Manufacturing.
Presenter: William Green (IBM)
This talk will review the development and performance of a cost-eflective silicon photonic trace gas sensing platform, which leverages silicon photonic waveguide and packaging technologies to perform on-chip evanescent field spectroscopy of methane.