Join an Application Integration Group (AIG)
Interested in collaborating with industry and academic partners on state-of-the-art prototype application-specific chips? The Knowledge and Innovation for Manufacturing Initiative will support you with organizational guidance and logistical arrangements.
Below are some examples of leading-edge applications for which integrated photonics has begun to develop chip-based solutions that can be manufactured.
- Data Centers: cloud computing data centers with ultralow heat loads
- RF Signal Processing: analog photonics that enable RF through microwave and THz signal processing for aircraft and Wi-Fi electronics
- Sensors: compact disposable sensors for the energy and medical industries
- LIDAR and phased array imaging: augmented imaging for intelligent vehicular automation and new video technologies
The Inititiative currently supports a consortium of eight companies and two universities that are prototyping a mid-board optical interconnection link. (Click here for the project’s overall technical plan, and here for a description of iNEMI’s collaborative role).
The 18-month consortium has 3 phases: (i) product specification based on system requirements; (ii) evaluation of options and gaps; (iii) prototype creation and evaluation. In principle, the team will implement within AIM facilities the design, fab/package and characterization by mobilizing skills and insights acquired gained from in AIM Academy’s online edX course and the 2018 IPSR roadmap study.
The Integrated Photonic Systems Roadmap (IPSR) needs your expertise to chart the near-term course of photonics technology adoption. The findings of each AIG team will be published as a specialized case study studies in the IPSR Roadmap, and as a separate white paper that presents a coherent argument for the next phase of Photonic Integrated Circuit (PIC) manufacturing development and deployment.
Please contact Cory James if you are interested in working on an AIG in any of the following application areas: