The Laser Scientist will work on the development of semiconductor optoelectronic devices including distributed feedback and high-power quantum cascade lasers, from proof-of concept prototyping all the way through manufacturing.
The AIM Photonics Test, Assembly, and Packaging (TAP) facility in Rochester, NY is dedicated to advanced photonic and electronic packaging.
Full custom photonic chip-scale 300mm wafer-scale packaging including heterogeneous integration capability.
Best-in-class 300m silicon photonic integrated circuit technology in Albany, NY
Opportunities in all electronic and photonic design automation, heterogeneous integration , III-V gain and lasers integrated into silicon PICS, MPW support, PIC component design, and application engineering technical areas.
Learn more here.