AIM Photonics is hiring

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AIM Photonics Institute
Albany and Rochester

The AIM Photonics Test, Assembly, and Packaging (TAP) facility in Rochester, NY is dedicated to advanced photonic and electronic packaging.  

Full custom photonic chip-scale 300mm wafer-scale packaging including heterogeneous integration capability.

Best-in-class 300m silicon photonic integrated circuit technology in Albany, NY

Opportunities in all electronic and photonic design automation, heterogeneous integration , III-V gain and lasers integrated into silicon PICS, MPW support, PIC component design, and application engineering technical areas.

Learn more below.