The AIM Photonics Test, Assembly, and Packaging (TAP) facility in Rochester, NY is dedicated to advanced photonic and electronic packaging.
Full custom photonic chip-scale 300mm wafer-scale packaging including heterogeneous integration capability.
Best-in-class 300m silicon photonic integrated circuit technology in Albany, NY
Opportunities in all electronic and photonic design automation, heterogeneous integration , III-V gain and lasers integrated into silicon PICS, MPW support, PIC component design, and application engineering technical areas.
Learn more below.